Continuous-Time Bipolar Switch
A1205
4
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information
Characteristic
Symbol
Test Conditions*
Value Units
Package Thermal Resistance
R
窲A
Package LH, 1-layer PCB with copper limited to solder pads
228 篊/W
Package LH, 2-layer PCB with 0.463 in.
2
of copper area each side
connected by thermal vias
110 篊/W
Package UA, 1-layer PCB with copper limited to solder pads
165 篊/W
*Additional thermal information available on Allegro Web site.
6
7
8
9
2
3
4
5
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
20 40 60 80 100 120 140 160 180
T
J(max)
= 165篊; I
CC
= I
CC(max)
(R
JA
= 228 篊/W)
Package LH, 1-layer PCB
(R
JA
= 110 篊/W)
Package LH, 2-layer PCB
(R
JA
= 165 篊/W)
Package UA, 1-layer PCB
V
CC(min)
V
CC(max)
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
20 40 60 80 100 120 140 160 180
Temperature (癈)
Power Dissipation versus Ambient Temperature
(R
?/DIV>
J
A
=
1
6
5
?/DIV>
C
/
W
)
1
-
la
y
e
r
P
C
B
,
P
a
c
k
a
g
e
U
A
(
R
?/DIV>
JA
=
2
2
8
?/DIV>
C
/
W
)
1
-l
a
y
e
r
P
C
B
,
P
a
c
k
a
g
e
L
H
(
R
?/DIV>
J
A
=
1
1
0
?/DIV>
C
/
W
)
2
-
l
a
y
e
r
P
C
B
,
P
a
c
k
a
g
e
L
H
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